Agenda	先进封装技术论坛（ Advanced Packaging Technology Forum）
Moderator	Dr. Yifan Guo, Vice President of Engineering, ASE Shanghai
13:00 - 13:10	Opening Remark
	Tom Salmon, Vice President, Global Member Services & Standards, SEMI
13:10 – 13:40	The evolvement of IC & packaging
	Dr. Ed Chang, Director, China Business Development, TSMC
13:40 – 14:10	3D Integration Opportunities and Plating Challenges
	Dr. Zhenqiu Liu, Director of Wet Process Engineering, TEL, USA
14:10 – 14:40	New Opportunity of Advanced Packaging Process Equipment
	Peijun Ding，Vice president, Beijing NMC Co.,Ltd.
14:40 – 15:10	Advanced CSP & Turnkey Solutions
	Fumio Ohyama, Deputy Chief Sales Officer, Tera Probe
15:10 – 15:40	Innovative Advanced Package Solutions for Mobile Application
	Chang-Yi (Albert) Lan，Senior Director, SPIL
15:40 – 16:10	3D-IC beyond smartphones
	Gregory Smith,General Manager, Computing & Communications Business Unit, Teradyne
16:10 – 16:40	Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices
	Rolf Aschenbrenner,IEEE Fellow / Deputy Director, Fraunhofer IZM
16:40 – 16:50	Closing and lucky draw (Huawei P6S Smart Phone)
	*议程变化请以网站为准（Please note, the agenda is tentative and subject to change.）