武汉大学教授 院长

简历：1992年在美国斯坦福(Stanford)大学获得博士学位。现任武汉大学动力与机械学院院长，武汉大学工业科学研究院执行院长。曾在1992年至1995年任教佛罗里达理工学院，1995年至2001年任教美国韦恩(Wayne)州立大学机械工程系和制造研究，并取得终生教职。在美国任职期间，1995年因在IC封装与复杂结构可靠性研究方面的杰出成就，被授予美国白宫总统教授奖，同期获奖人员包括邓兴旺院士、李静博士、司捷;因在IC和MEMS封装与CAD研究方面的成就而获得美国自然科学基金委青年科学家奖。2001年从美国韦恩州立大学辞职回国效力，将留美期间在电子制造与封装领域的先进理论带回华中科技大学，并在国内率先开展先进电子封装研究，并在国内形成电子制造与封装集成这一热门研究方向。研究方向:先进制造(增材制造、激光冲击强化、飞秒激光微细加工)，先进材料及力学，微电子、光电子、LED、MEMS、汽车电子系统封装和组装、快速可靠性评估及设计，微电子机械系统的微尺度检测和计算机辅助设计，IC设计等。

演讲题目:微针电极阵列及应用

简介：孙道恒，福建省微纳制造工程技术研究中心主任。兼任中国微米纳米学会理事，全国MEMS标准化委员会委员、福建省机械工程学会副理事长，IEEE NEMS2010组委会主席等。主持完成国家自然科学基金重点项目、科技部863项目等20余项，发表论文230余篇，授权发明专利80余项，出版学术专著3部。研制的高精度MEMS谐振压力传感器、陀螺仪、全SiC压力传感器、喷胶头等，主要性能指标达到国际先进水平，成功应用于相关型号和产业。首创近场电纺（NearFieldElectroSpinning）原理与方法,突破电纺直写关键技术，研制出系列微纳3D打印装备，并运用于柔性电子、微传感/执行器的制作。

Prof. Daoheng Sun received his BS, MSand PhD in Mechanical Engineering from Northeastern University, China. He joined after his Post-Doc in Southwest Jiaotong University, and he serves nowas DeputyDean of School of Aerospace Engineering, Director of Fujian Micro/Nano Manufacturing Engineering Center. He worked atUniversity of California at Berkeley as senior visiting scholar for two years. His research area is on MEMS, microsensors and actuators, micro/nano-scale additive fabrication technologies and applications. He published 230+ peer-reviewed publications and invented 70+ patents.

简历：is Senior Product Marketing Manager at Evatec. He is globally responsible for the market segment MEMS in terms of strategy and strategic project and customer acquisition. His genuine interest in advanced functional materials with piezoelectric and magnetic properties emphasize his dedication to the MEMS and Sensors market in particular. Maurus had a number of positions in the PVD-equipment industry (Balzers, unaxis, Oerlikon and now Evatec) ranging from Application Engineer, System Engineer, Project Manager to Product Manager over the years and also spent 3 years leading a research section at CSEM in Neuchatel, Switzerland. He is an Engineer in Control Electronics from the University of Applied Sciences in Buchs, followed by a MAS in Business Engineering / International Marketing from the HochschulefürWirtschaft und Technik in Zurich, Switzerland.

简历：，联华电子MEMS资深处长, 特殊技术开发处,

王军波

简历：王军波，中国科学院电子学研究所研究员，传感技术国家重点实验室副主任，2002年博士毕业于清华大学，主要研究领域包括MEMS、微纳传感器和微流控芯片技术。发表期刊论文120余篇，获得国家杰出青年科学基金资助。

高建龙

演讲题目:集成式混式键合技术，及全自动键合机XBS300

简历：先生目前就任SUSS MicroTec公司的键合技术专家一职。自从2006年加入SUSS以来，他便一直专注于晶圆键合工艺。十多年来，他和SUSS全球晶圆键合专家团队，与国内多家半导体工厂、研究所及大学共同工作，帮助客户研究，发展及完善晶圆键合工艺在半导体制造多个领域的应用。

简历：is currently working at USHIO INC. as semiconductor/ MEMS application equipment sales leader. USHIO is world largest industry-used light source supplier in semiconductor market as well as a process solution provider with light source equipped tools for several decades. He joined USHIO INC. in 2004, and since then has engaged in the marketing and sales of USHIO lithography tool for various market such as MEMS device and advanced packaging substrate industry. He was a promotion leader of lithography system for advanced package substrate from 2010-2013, and he is a promotion leader of lithography system for MEMS and sensors from 2014-now.

古瑞琴

无锡微奥科技有限公司/MEMS设计部经理