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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)已过期 |
会议内容
会议简介
征稿信息
重要日期
征稿简介
- ADVANCED PACKAGING
- SUBSTRATE TECHNOLOGIES
- INTERCONNECTION TECHNOLOGIES
- MORE THAN MOORE
- MEMS
- OPTOELECTRONICS
- NANO TECHNOLOGIES
- GREEN ELECTRONICS
- MEDICAL ELECTRONICS
- POWER ELECTRONICS
- SMART TEXTILES
- MANUFACTURING TECHNOLOGIES AND MATERIALS
- MODELLING
- THERMAL MANAGEMENT
- RELIABILITY and QUALITY
- COMPUTING
- APPLICATIONS
- BUSINESS ASPECTS
主办方：IEEE Electronics Packaging Society
主办方：International Microelectronics and Packaging Society Europe - iMAPS Europe
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